Memory module container

ABSTRACT

A container for memory modules comprising a generally rectangular shape with a lid and tray with a multitude of finger-like protrusions forming vertical slots therebetween for receiving memory modules. The interior is formed such that a cavity may be created above and below the memory modules contained inside providing a buffer region, which protects the contents from damage when the exterior of the container is subjected to physical contact.

This is a continuation of application Ser. No. 08/268,665 filed on Jun.29, 1994, U.S. Pat. No. 5,441,150, which is a continuation ofapplication Ser. No. 07/939,988 filed on Sep. 3, 1992, now abandoned.

BACKGROUND OF THE INVENTION

a. Field of the Invention

The field of the invention pertains to memory module containers, morespecifically, memory module packaging for SIMMs and SIPPs.

b. Background Art

Memory modules are generally composed of integrated circuits mounted onprinted circuit boards of various shapes. These modules, although fairlydurable, may be damaged by electrostatic discharge or excessive physicalimpact. Antistatic plastic bags and cardboard boxes are among thecontainers currently being used for storing and handling memory modules.

One disadvantage of these types of containers is the difficulty inperforming a final inspection. The bags are difficult to see throughbecause they are typically constructed from opaque or nearly opaqueantistatic plastic, and the cardboard boxes are impossible to seethrough. Therefore, when these types of containers are used, it islaborious, if not impossible, to visually check the container's contentsor to determine how many modules are stored therein. To perform aninspection of the contents, therefore, it is usually necessary to openthese containers. Since the modules may be destroyed by an electrostaticdischarge, any inspection of the contents of these containers isgenerally done in an electrostatically safe environment. Additionally,the plastic bags are often held closed by a paper warning label or alabel indicating the contents of the bag. Opening one of these bags forinspection will destroy the label, requiring the application of a newlabel. Furthermore, since the bags generally have one opening at theirend, depending on the inspection being performed, the inspector may haveto dump out all of the modules. While the cardboard boxes may not bedamaged by opening and closing, they are often difficult to open andclose and must also usually be opened in an electrostatic-freeenvironment.

Another disadvantage of the plastic bags is the lack of protection fromphysical damage. The protection from physical damage furnished by theuncushioned, thin-walled, flexible plastic bags is minimal. Modulesstored in one of these bags are therefore subject to damage fromexternal physical shocks. Further, because of their construction, thebags do not restrain the modules from independent movement. The modulescan abrade against each other, causing physical damage from internalmovement of the module. Therefore, it is particularly undesirable topackage a large quantity of modules in a single storage bag.

Another reason large quantities of modules are not stored in a singlebag is that, the higher the number of modules, the more difficult it isto ascertain how many are contained in a storage bag without opening it.It is also impracticable to include more than one type of module in asingle bag because it is difficult to verify that the bag contains morethan one type of module and to verify the quantity of each typeincluded.

Since each plastic bag generally contains a relatively small number ofmodules, a large number of bags is required, resulting in increasedpackaging costs. The cost for packaging the modules in bags is also highbecause, as the number of packages increases, so do the labor charges topackage the modules. Each bag must be opened, closed, sealed, andlabeled. Costs are further increased because, depending on how they wereclosed, the bags are ripped open by the purchaser, preventing reuse.

Another disadvantage of the plastic bags centers around the problems ofmaintaining an inventory of the as yet unfilled bags. Being flexible,the bags are difficult to stack. Even after they are filled, since theirexterior shape is defined to a large extent by their contents, theyremain difficult to stack.

Cardboard box containers afford more physical protection for the modulesthan do the plastic bags. However, these boxes are typically lined withantistatic foam or bubble packing to stabilize, confine, and cushion themodules. Due to this packaging, the boxes are large and bulky, tradinglarger size for enhanced protection. Much like the plastic bags, thecardboard-box type containers are labor intensive to pack. The moredifficult the packing, the longer it takes and the more it costs.

SUMMARY OF THE INVENTION

The instant invention comprises a memory module container capable ofsecuring each module separately. This is accomplished by a unique modulesupport structure, which is formed into the inner walls of thecontainer. These containers may also have impact absorbing cavitiesformed above and below the module support structure. In a preferredapplication, the container is constructed of semi-transparent,antistatic plastic. Such a novel arrangement not only makes it possibleto inspect the contents of the package, but also provides a certaindegree of protection to the contents. Since the contents are visiblewhen the container is closed, the contents of a single container neednot be identical. This container may also be reused, which results incost savings. These containers provide a means for easily storing,handling, and inspecting memory modules, while protecting the modulesfrom electrostatic as well as physical damage.

Accordingly, it is an object of the disclosed invention to provide animproved container for memory modules.

A more detailed explanation of the invention is provided in thefollowing description and claims, and is illustrated in the accompanyingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a container in accordance with a firstembodiment of the present invention, shown with the lid open and onememory module inserted inside the container.

FIG. 2 is a perspective view of a container in accordance with a secondembodiment of the present invention, shown with the lid open and onememory module inserted inside the container.

FIG. 3 is a front view of the tray of the container of FIG. 1.

FIG. 4 is a side view of the container of FIG. 1.

FIG. 5 is a side view of the container of FIG. 1 shown with the lidclosed.

FIG. 6' is a top view of the container of FIG. 4 showing a sample of thetype of information that may be formed into the lid.

FIG. 7 is an enlarged view of section 7--7 of the container of FIG. 6.

FIG. 8 is an enlarged view of section 8--8 of the container of FIG. 6.

DESCRIPTION OF THE PREFERRED EMBODIMENT

A further understanding of the present invention may be had by referenceto the following description taken in connection with the accompanyingdrawings. Referring to FIGS. 1 and 2, two preferred embodiments of amemory module container 10 are represented as being of a one-piece,clam-shell construction. Preferably, the lid 13 and the tray 16 areconstructed from a single piece of material. In these preferredembodiments, the material is 0.015 inch thick polyvinyl chloride (PVC)with an antistatic coating. When the lid 13 is opened or closed itfollows the path represented by arc 67 in FIG. 4 as the lid 13 rotatesaround hinge line 58. Hinge line 58 is created by creasing the materialbetween the lid 13 and the tray 16. In this arrangement, the lid 13 andthe tray 16 remain connected to each other.

As shown to the best advantage in FIG. 7, there are finger-like trayprotrusions 70 formed into the tray inner walls 106, creating verticalslots 19 between adjacent tray protrusions 70. Memory modules 22 areinserted into slots 19, which are spaced apart by a distance equal tothe width of a tray protrusion 70. The width of each tray protrusion 70is at least as large as the height of the components 73 mounted on theprinted circuit boards 76 of the modules 22. Depending on the type ofcomponents and their resistance to physical damage, the width of thetray protrusions 70 will vary. The slots 19 are approximately the samewidth as the printed circuit boards 76, such that, when inserted intothe container 10, the modules 22 are held substantially free frommovement.

At the root 79 (see FIGS. 4 and 5) of the vertical slots 19, a ledge 25is formed into the tray 16. The ledge 25 extends beyond the trayprotrusions 70. Lower edges 85 of the memory modules 22 rest on theledge 25 after insertion into the slots 19. In this configuration,approximately three-quarters of the width of the modules 22 rest at orbelow the upper flange 28 of the tray 16 as seen best in FIG. 3. Thisallows for easy removal of the module 22 from the container 10, whileproviding sufficient support such that the module stays substantiallyperpendicular to the ledge 25.

In the preferred embodiment shown in FIG. 1, a lower cavity 31 existsbelow the modules 22 when they are inserted into the tray 16. The lowercavity 31 has side walls 82 that are preferably 0.25 inches in height,which is the distance between the container base 88 of the tray 16 andthe ledge 25. This lower cavity 31 provides a cushioning region orbuffer zone, which absorbs some of the shocks and crushing impacts towhich the container may be subjected. Since the modules 22 may not touchthe container base 88 of the tray 16 in this preferred embodiment, themodules 22 are protected from physical shocks.

In the preferred embodiment shown in FIG. 2, three elongated lowercavities 31 (two of which may be seen in FIG. 2) exist below the modules22 when they are inserted into the tray 16. The lower cavities 31 inthis embodiment are approximately 0.0625 inches deep. As in thepreferred embodiment of FIG. 1, these lower cavities 31 providecushioning regions or buffer zones, which absorbs some of the shocks andcrushing impacts to which the container may be subjected. In addition,the elongated cavities 31 increase the structural rigidity of the tray16.

Referring again to the embodiment shown in FIG. 1, a second cavity 34 isformed into the lid 13, which is tiered or stair stepped, with a firstsurface 37 approximately half way between a second surface 40 of the lid13 and a lid lip 43, which forms the horizontal surface of the lid 13that is closest to the tray 16. In this preferred embodiment, the secondsurface 40 and the first surface 37 are displaced approximately 0.3inches from each other. When the lid 13 is closed, the first surface 37abuts upper flange 28 of the tray 16 around the entire circumference ofthe upper flange 28. As can be seen to the best advantage in FIG. 5,when the lid 13 is closed, the upper edges 91 of the modules 22 do nottouch the second surface 40 of the lid 13 in this preferred embodiment.The distance between the first surface 37 and the second surface 40 maybe greater than the approximately one-quarter of the width of themodules 22 that protrudes into the second cavity 34 formed between thefirst surface 37 and the second surface 40 of the lid 13. Therefore, asmall portion of the second cavity 34 may be able to absorb somephysical shocks or impacts that may be applied to the second surface 40and thereby may provide a certain amount of protection to the modules22.

As an alternative to the smooth cavity 34 formed in the lid 13 of theembodiment shown in FIG. 1, FIG. 2 shows an embodiment wherein there arefinger-like lid protrusions 71 formed into the lid inner walls 109, muchlike the tray protrusions 70, which may be seen to best advantage inFIG. 7. The lid 13 of the embodiment of FIG. 2 is tiered or stairstepped like the embodiment of FIG. 1, with a first surface 37 between asecond surface 40 of the lid 13 and a lid lip 43, which again forms thehorizontal surface of the lid 13 that is closest to the tray 16. In thispreferred embodiment, the second surface 40 and the first surface 37 aredisplaced from each other a distance that is approximately equal to orslightly greater than the approximately one quarter of the width of themodules 22 that protrudes into the lid 13. As in the embodiment depictedin FIG. 1, when the lid 13 is closed, the first surface 37 abuts theupper flange 28 of the tray 16 around the entire circumference of theupper flange 28.

Above and behind the slots 19, a wall 46 is formed into the tray 16. Thewall 46 connects the upper flange 28 to the tray lip 55. In thispreferred embodiment, the wall 46 is approximately 0.2 inches in height.The upper flange 28 is preferably 0.2 inches wide. The wall 46 helpsalign the lid 13 as the lid 13 is closed and increases the rigidity ofthe tray 16. In addition, eight indentations 49 are formed into the wall46 at least adjacent to each corner of the container 10.

One corner of container 10 is depicted in FIG. 8, which shows twoindentations 49 in the tray 16. These indentions 49 are one-tenth of aninch deep by three-quarters of an inch long in this preferredembodiment. The lid 13 has eight extruded ridges 52 formed into it atpositions that correspond to the eight indentations 49 in the tray 16.Two of these extruded ridges 52 are shown in FIG. 8 as they appear whenthe lid 13 is closed. In FIG. 8, the lid 13 is shown in phantom and thetray 16 is shown with solid lines. This was done to make it easier todistinguish parts of the lid 13 from parts of the tray 16. Since thecontainer 10 is transparent in this preferred embodiment, it is possibleto see both the lid 13 and the tray 16 simultaneously. Therefore, thephantom lines were used in FIG. 8 merely to aid comprehension and not inthe usual sense to represent hidden components.

A latch releasably holds the container closed. In the preferredembodiments, when the lid 13 is closed, the extruded ridges 52 "snap"into the indentations 49, and the lid 13 is latched securely over thetray 16. Unless purposely opened, the container 10 remains closed, thusproviding a secure container for the memory modules 22. The latch,comprising the indentations 49 and the extruded ridges 52, is anintegral part of the container 10 in the preferred embodiments, whichsaves space, weight, material, and cost.

Around the circumference of the exterior portion of the base of wall 46is a tray lip 55, which is approximately 0.25 inch wide in thispreferred embodiment. This tray lip 55 serves as the outer rim on thetray 16 and increases the rigidity of container 10.

The lid 13 and the tray 16 are formed in one piece in which a first backedge 94 of the tray lip 55 is connected to a second back edge 97 of thelid lip 43. At this connection point, a hinge line 58 is created bycreasing the plastic, making the container 10 easier to close. Thisintegrated hinge 58 requires no additional parts, which results infurther cost savings.

Along a first front edge 100 of the tray lip 55, there is a tray tab 61.Similarly, along a second front edge 103 of the lid lip 43, there is alid tab 64. These tabs 61, 64 are intentionally misaligned (as can beseen to best advantage in FIG. 6) to facilitate easy opening and closingof the container 10. The misaligned tabs 61, 64 may be readily graspedby a person to open the container 10.

The lid 13 of this preferred embodiment is formed from PVC, which may beformed with pertinent information. FIG. 6 depicts an example of the typeof information that may be formed into the lid 13. This information mayinclude, for example, the type of modules, proper uses for the modules,the manufacturer of the modules, the quantity of modules, modulehandling precautions, the patent number, or warnings. Although standardglued labels may be used with this container, forming informationdirectly into the lid 13 saves labels and extra procedures.

While what has been described above are preferred embodiments of thisinvention, it will be obvious to those skilled in the art that numerouschanges may be made without departing from the spirit or scope of theinvention. It is intended that all matter contained in the abovedescription or shown in the accompanying drawing shall be interpreted asbeing illustrative only and not limiting. The invention therefore is notto be limited except in accordance with the below claims.

I claim:
 1. A method for placing memory modules into a containercomprising the steps ofopening the container, the container having alid; inserting the memory modules in slots formed between protrusionsformed into the container, each of the slots having a root; seating themodules on a ledge at the root of the slots; filling a desired number ofthe slots with the memory modules; closing the lid of the container; andsecuring the lid with a latch.
 2. The method of claim 1 furthercomprising an inspection step after said step of securing said lid todetect the number of memory modules contained in the container.
 3. Themethod as defined by claim 2, wherein said step of inspecting is carriedout by an automatic detecting means.
 4. The method as defined by claim3, wherein said automatic detecting means is a photocell.